The world’s largest chip maker, TSMC has the Just announced Another process node that will, almost certainly, will undoubtedly be included in a doubt of AI chips, will be used to make some of our gaming GPUs and CPUs in the future. This next generation process is ‘A14’, which means 14 English or 1.4 nanometers or really, Really Little
It was announced yesterday at the TSMC’s North America Technology Symposium, and the company says the process was “designed to advance AI change through fast computing and high power performance.”
TSMC was already the largest chipmaker in the world before all this AI business really started to start, but since then, it is the name of a company, as well as, along with Navalia, it is on a ton of people. Naturally, after that, talk about the nodes of its upcoming process will be of interest to many people, but we can also throw PC gamers into the ponds of spectators in our hats.
The reason for this is that TSMC makes many chips that end up in the best gaming CPU and the best graphics card, whether it be from AMD, NVIDIA, or even Intel. Currently, for example, NVIDIA RTX 50- Series GPUs are mainly made on TSMC 4 NM node, and the same is the case for AMD’s Raisen 9000-series processors. Intel’s aero -leak chips are now specially created by TSMC, since Intel killed its 20A process last year.
The newly announced A14 node has been planned for 2028. In comparison to its upcoming N2 process (scheduled at the end of this year), TSMC says “A14 will offer up to 15 % of the same strength, or offer 30 % power reduction at the same pace, as well as increase the logic density by more than 20 %.”
Although it is a few years left, I can’t help but am a bit excited about the new process. The main reason for this is that we have seen with the GPU of the RTX50 series that if the new GPU generation cannot have a new process if it cannot fall on the back of a new process (RTX50 series is in the same process as the RTX 40 series).
It is being said, NVIDIA usually does not use blood flowing nodes for its GPUs, and we will have the most likely to start using A14 using A14.
According to our colleagues, A14 will not be back side power delivery by 2029 Tom’s hardware. Back side power delivery essentially transmits electrical connectivity to the bottom of the chip, which leads to strength to travel, thus increasing efficiency and efficiency.
We expect the first TSMC to see back side power delivery (alias ‘superpower rail’) with A16 in 2026. Intel is ahead in the game, however, its 18A process already has a back side power delivery and is ready to go two months ago.
As far as this A14 production will also be presented in the United States, as well as Taiwan Fabs of the TSMC, it seems that this may happen. I am based on the company’s recent Income callIn which the company claims that six fees have been planned in Arizona: “In this six fib, 2 nanometers will be a big node, and I will say, 30 % will be there. Over time, 2 nanometers will be 1.4 and 1.0, it has not yet been discussed.”
It was in response to the question of how many percent of the future leading nodes would come from Taiwan to the United States vs, and in my ears it seems as if TSMC is saying that 1.4 and 1.0 will come from the United States, but this percentage has not yet been discussed.
Whatever the case, there is some healthy development in the nodes of the board here, whether TSMC, Intel, or anyone else. By changing architectural and AI aside, increasing raw performance is a direct result of transistor density, and we can all be behind it.
